Broadcom Inc.

Overview

Broadcom designs, develops and supplies a wide range of semiconductor and semiconductor-based solutions, along with infrastructure software. The company operates globally across design, development, manufacturing and sales with a focus on scale, engineering depth and integrated offerings.

Business segments and core offerings

Semiconductor Solutions

• Portfolio includes complex digital and mixed-signal devices based on CMOS and III-V, NICs, switches, modules, racks and related subsystems.
• End markets and applications:
  • Networking connectivity: data center, service provider and enterprise networking; Ethernet NICs, switching, PHYs, optical components and subsystems.
  • Wireless device connectivity: RF front-end modules, FBAR filters, Wi‑Fi/Bluetooth connectivity, touch controllers, inductive charging ASICs.
  • Servers and storage: PCIe switches, SAS/RAID, Fibre Channel, HDD/SSD SoCs, read channels and storage hardware/software components.
  • Broadband: set-top SoCs for cable/satellite/IPTV and broadband access for central offices and CPE.
  • Industrial: automation components, sensors, optics, Ethernet ICs and related products.
• XPUs (custom accelerators) and Ethernet switching/routing silicon are key AI-related offerings.
• R&D is a core priority, with ongoing investment in new platforms and technologies and selective acquisitions to expand capabilities.

Infrastructure Software

• Software to simplify and secure private, hybrid and edge IT environments across five portfolios:
  • Private cloud: VMware Cloud Foundation (VCF) and related offerings (VCF Edge, vSphere Foundation, Telco Cloud Platform, VMware Private AI, VMware Live Recovery, application networking and security, Tanzu Platform).
  • Mainframe software: AIOps & automation, databases & data management, DevX & DevOps, cybersecurity & compliance, foundational & open mainframe.
  • Cybersecurity: endpoint, network, information and application security, plus identity and access management.
  • Enterprise software: AIOps/automation, automation and network observability, DevOps, value stream management.
  • FC SAN management: modules, switches and subsystems for storage networking.
• VMware and related offerings are central to the private cloud portfolio, supporting private AI services, edge deployments and cloud-native development with Tanzu.

Strategic focus

• Strategy emphasizes sustained technology leadership and category-leading solutions through a mix of internal R&D and acquisitions.
• The VMware acquisition expanded Broadcom’s software and virtualization capabilities and is a major element of the company’s strategy.

Research and development

• Ongoing investment in product development, high-value platforms, integration and process improvements.
• Global engineering and design teams support continuous product and software development.

Manufacturing and supply chain

• Operates a global, outsourced manufacturing model:
  • Front-end wafer manufacturing is largely outsourced to foundries.
  • Major contract manufacturers (assembly/test) include TSMC, ASE, Foxconn, Amkor and SPIL.
  • Internal fabrication is retained for FBAR filters and certain GaAs/InP laser hardware; commodity CMOS is largely outsourced.
• Suppliers and capacity:
  • About 95% of wafers in fiscal 2025 were produced by TSMC.
  • Approximately two-thirds of manufacturing materials are sourced from five suppliers; some components are single-source.
  • Primary manufacturing regions are in Asia, with significant operations in the U.S. and Europe.
  • Most inventory is stored in a Malaysia-based warehouse.
• Capacity management and risk:
  • The company maintains flexibility to adjust capacity and suppliers to meet demand and identifies potential risks from contract manufacturer capacity constraints, component shortages and trade tensions or tariffs.

Customers

• Customer concentration:
  • Distributors accounted for 48% of net revenue in fiscal 2025 and 2024.
  • Aggregate sales to the top five end customers were about 40% of net revenue in fiscal 2025 and 2024.
• Sales channels include direct sales, distributors, OEMs and contract manufacturers, with a focus on large enterprise, hyperscale and government customers.

Employees and geographic footprint

• As of November 2, 2025:
  • Approximately 33,000 employees worldwide.
  • About 57% of employees are in research and development roles.
  • Geographic distribution: ~49% in North America, ~36% in Asia, ~15% in Europe, the Middle East and Africa.
• The workforce has a strong engineering and semiconductor design focus across global locations.

Intellectual property

• Patent portfolio and filings:
  • Approximately 19,000 U.S. and other patents issued.
  • About 2,170 U.S. and other patent applications pending.
  • Patent expirations generally range from 2025 to 2044.
• Protection includes patents, copyrights, trademarks, trade secrets and licenses, along with cross-licensing arrangements and use of open-source components in some software.

Financial snapshot

• Aggregate indebtedness was approximately $67,120 million as of November 2, 2025.
• Distributor and top-customer concentrations represent an identifiable revenue concentration risk.

Headquarters and key facilities

• Headquarters: Palo Alto, California.
• Primary warehouse and significant logistics facilities located in Malaysia.
• Large global footprint of owned and leased facilities across the U.S. and international locations.