Credo Technology Group Holding Ltd

CIK: 18077943 Annual ReportsLatest: 2026-06-15
Revenue: $1,335,116,000Net Income: $472,279,000Source 10-K
Disclaimer: AI-assisted summary of SEC Form 10-K filings. Not official company content and not investment, legal, accounting, or tax advice. See full disclaimer here.

10-K / June 15, 2026

Revenue:$1,335,116,000
Income:$472,279,000

10-K / July 2, 2025

Revenue:$436,800,000
Income:$52,200,000

10-K / June 24, 2024

Revenue:$193,000,000
Income:-$28,400,000

10-K / June 15, 2026

Credo Technology Group Holding Ltd

Overview

Credo Technology Group is a fabless semiconductor company focused on high-speed connectivity for data infrastructure, AI/ML, and cloud-scale computing. The company designs and licenses SerDes IP and supplies a portfolio of connectivity products and software to enable high-bandwidth, power-efficient data center interconnects. Its offering combines ICs, active electrical cables, optical transceivers, memory connectivity solutions, and a system-level software platform to address Ethernet, PCIe, and related interconnect requirements.

Product and solution families

  • ZeroFlap AECs (Active Electrical Cables)
    • Copper interconnects up to 7 meters for high-density data-center interconnects with lower power and smaller volume than alternatives
    • Sub-families: CLOS, SPAN, SHIFT, SWITCH for rack-to-rack and NIC-to-ToR use cases
  • Optical PAM4 DSPs
    • High-speed optical signal processing for transceivers and AOCs
    • Lane speeds: 50G, 100G, 200G
    • DSP families: Seagull (50G/lane), Dove/Lark/Robin (100G/lane), Bluebird (200G/lane; introduced 2025) for 1.6T-capable transceivers
  • ZeroFlap Optical Transceivers
    • System-level features to reduce optical link flaps, provide telemetry, and enable remote manageability for AI cluster stability
    • Speeds up to 400G, 800G, and 1.6T (2xDR4 configurations)
  • OmniConnect
    • SerDes-based fabric for memory expansion and scalable memory–compute interconnects, including fanout and off-substrate memory placement with Weaver
  • Weaver memory fanout gearbox
    • Enables high-density memory expansion (off-substrate LPDDR) aimed at AI memory bandwidth needs
  • SerDes Chiplets
    • Chiplet-based SerDes solutions for multi-chip modules to allow core logic in advanced processes while using Credo SerDes on a separate die
  • PCIe Retimers
    • Toucan PCIe Gen6.x / CXL 3.x retimers (7nm) for extending PCIe reach with low latency and high signal integrity
  • PILOT software platform
    • Telemetry and analytics for predicting and preventing link degradation to improve reliability and uptime
  • MicroLED solutions (in development)
    • Optical microLED approaches focused on high data rates and copper-like reliability for AI data-center scaling
  • IP licensing
    • Comprehensive SerDes IP portfolio licensed for customer integration

Markets and use cases

  • Hyperscalers and NeoClouds
  • Cloud infrastructure providers, OEMs/ODMs, and optical module manufacturers
  • Enterprise and HPC networks
  • Targeted applications: Ethernet and PCIe interconnects for AI data centers, front-end/scale-out/scale-up/scale-in architectures, and memory-centric AI workloads

Customers and revenue concentration

  • Serves more than 20 blue-chip customers
  • Fiscal 2026: top 10 customers accounted for about 90% of total revenue
  • Two customers accounted for 10% or more of total revenue in fiscal 2026

Growth and strategy

  • Extend leadership in SerDes technologies
  • Broaden the product portfolio to meet evolving data infrastructure and adjacent market needs
  • Accelerate new customer acquisition and expand penetration with existing customers
  • Deepen relationships with major customers, including hyperscalers, NeoClouds, and OEMs/ODMs

Business model and manufacturing

  • Fabless model: in-house design, outsourced wafer fabrication and assembly/testing
  • Primary foundry: Taiwan Semiconductor Manufacturing Company (TSMC); exclusive wafer fabrication in fiscal 2026
  • Assembly and testing partners: Amkor Technology, ASE (packaging), KYEC, Sigurd (testing)
  • BizLink for AEC manufacturing
  • Product portfolios built around Credo’s SerDes IP and DSP technologies to enable customer design-in across memory and network interconnects

Employees and internal resources

  • Total full-time equivalent (FTE) employees: 807
  • Engineers: 616 (as of May 2, 2026)
  • Geographic distribution: approximately 330 in North America; approximately 477 in Asia

Financial highlights

  • Total revenue
    • Fiscal 2026: $1.3 billion
    • Fiscal 2025: $436.8 million
  • Net income (loss)
    • Fiscal 2026: $472.3 million net income
    • Fiscal 2025: $52.2 million net income
    • Fiscal 2024: $28.4 million net loss
  • Accumulated deficit: $83.2 million as of May 3, 2025 (historical context prior to 2026 results)
  • Research and development expenses
    • Fiscal 2026: $279.4 million
    • Fiscal 2025: $146.9 million

Intellectual property and technology leadership

  • Selected patent holdings
    • United States: 86 issued patents, 39 pending
    • China: 52 issued patents, 41 pending
    • Hyperlume (U.S. subsidiary): 16 U.S. pending, 13 China pending
  • Technology focus areas: 1.6T AEC market, 112G/2x/4x/8x 50G PAM4 DSPs, 40G PAM3 SerDes, 800G DSPs, and a 1.6T roadmap (including 2xDR4)

Key facilities

  • Total approximate leased space across major locations: about 317,449 square feet
  • Locations: United States, Mainland China, Taiwan, Canada, Hong Kong, Singapore
  • Lease expirations range from 2026 through 2033, with renewals contemplated

Governance and partnerships

  • Corporate structure: Cayman Islands exempted holding company operating through U.S. and international subsidiaries
  • Emphasis on ESG, risk management, and cyber risk governance in reporting
  • Selected partnerships
    • Oracle: collaboration on ZeroFlap Optics to address reliability in data-center AI clusters
    • OmniConnect/Weaver ecosystem development to address AI memory bandwidth challenges