Lam Research Corporation

Summary based on the 2025 Form 10-K excerpt.

Company overview

• Global supplier of wafer fabrication equipment and services for the semiconductor industry.
• Core competencies include nanoscale manufacturing enablement, chemistry, plasma and fluidics, advanced systems engineering, and a range of operational disciplines.
• Focuses on enabling customers to build smaller, higher-performing devices for mobile, personal computing, cloud/enterprise servers, wearables, automotive, and data storage.
• Customer base includes leading semiconductor memory manufacturers, foundries, and integrated device manufacturers producing NVM, DRAM, and logic devices.

What Lam provides

• End-to-end wafer processing equipment used to fabricate multiple dies or ICs on a wafer, covering hundreds of process steps and precise control at the atomic scale.
• Emphasis on high productivity and cost-effectiveness alongside technical performance.
• Integration of hardware, process, materials, software, and process control to deliver wafer-level results.

Products and product families

Deposition

• SABRE family: copper deposition for copper interconnects and packaging applications.
• ALTUS family: tungsten/molybdenum deposition with ALD/CVD capability in a single system.
• Additional CVD/ALD solutions for barrier films and conformal coatings.

Dielectric films and related processes

• ALD, HDP-CVD, and related dielectric film technologies.

Etch

• Product families: Kiyo, Versys, Syndion, Striker, Vantex.
• Capabilities include conductor/dielectric etch, deep silicon etch, high-aspect-ratio etch, multi-frequency and multi-step etch, deep/trench etch, and advanced patterning.

Clean

• Coronus: wafer-edge bevel cleaning.
• DV-Prime, Da Vinci, EOS, SP Series: wafer cleaning and silicon wet etch.
• Wet cleaning and edge/face cleaning for WLP and IoT applications.

Packaging-oriented and additional capabilities

• Support for WLP/back-end processing, fan-out panel-level packaging, 3D stacking (HBM), and related packaging workflows.
• Equipment designed to support cobalt, copper, and other metallization schemes through specialized deposition and etch steps.

Markets and applications

• Primary markets: semiconductor memory, foundry, and IDMs.
• Applications include devices for mobile, computing, cloud, AI, 5G, IoT, wearables, automotive, and data storage.
• Packaging and interconnect applications (HBM, TSV, redistribution layers) enabled by Lam’s deposition and etch solutions.
• CIS and MEMS markets that use Lam’s process technologies.

Services and after-sales

• Customer Support Business Group (CSBG) provides products and services to maximize installed equipment performance.
• Offerings include customer service, spare parts, upgrades, and refurbished non-leading-edge products.
• Fleet-level Equipment Intelligence solutions for uptime, throughput, and defect reduction.
• Reliant product line for new and refurbished non-leading-edge equipment.
• Service and upgrade options designed to extend equipment life and improve return on capital.

Research, development, and strategy

• Ongoing investment in research and development to sustain product and process leadership.
• Close relationships with customers and suppliers to respond to evolving requirements.
• Competitive strategy centered on sustaining engineering, product and process development, ecosystem collaboration, and a broad, multi-product portfolio.

Operations and globalization

• Global facilities network with substantial international sales and service presence.
• Identified risks include export controls, tariffs, staffing challenges, tax considerations, currency fluctuations, and political/economic conditions.
• Revenue reporting is geographic-based, as described in Note 19 of the Consolidated Financial Statements.

Fiscal context

• Fiscal periods referenced: years ended June 29, 2025; June 30, 2024; June 25, 2023.